Assignment Details
Our client, a boutique technology consulting and enterprise solutions provider is planning to venture into the Automotive Chiplet industry and has approached us for the preparation of a Detailed Project Report (DPR). The report will encompass technical, economic, financial, and strategic aspects to facilitate funding approval, industry collaboration, and program execution.
To support this initiative, we are seeking a Technical Expert who will be responsible for conducting an in-depth technical evaluation of the project.
Scope of Work:
1. Chiplet Technology Overview
Explain Chiplet architecture, packaging requirements, interconnect standards (UCIe, BoW, ACC), and modular design benefits.
Assess heterogeneous integration (CPU, GPU, AI accelerators, Memory).
2. System and Packaging Requirements
Define packaging assumptions and requirements (70x80 mm², multi-chiplet integration, thermal stability, co-packaged memory).
Discuss die-to-die interfaces (UCIe-S, UCIe-A), power delivery, and thermal design.
3. Functional Safety & Reliability Standards
Evaluate functional safety (FuSa) requirements for automotive chiplet systems (ASIL-B, ASIL-D).
Assess failure analysis, predictive maintenance, and reliability modeling.
4. System Infrastructure & Prototyping
Outline software-defined vehicle (SDV) architecture, boot flows, cybersecurity, and telemetry integration.
Propose validation methods including hardware test vehicles and digital twin models.
5. Investment Plan & Cost Estimates
Develop a financial breakdown for the $1 billion program outlay, including $500 million funding from the Government of India.
Estimate R&D costs, fab setup, licensing, talent development, and infrastructure needs.
6. Job Creation Projections
Estimate direct employment (5,000–7,000 jobs) and indirect employment (30,000–40,000 jobs).
7. Implementation Roadmap
Define program phases and timelines:
Phase 1 (2024-2026): Research, feasibility studies, initial prototyping.
Phase 2 (2026-2028): Product development, pilot fabrication, testing.
Phase 3 (2028-2030): Commercialization, full-scale manufacturing.
8. Consortium & Stakeholder Engagement
Define roles of IMEC, IBM, Rapidus, Bosch, ARM, ASRA Consortium, etc.
Detail the India Automotive Chiplet Centre (IACC) governance model.
9. Risk Analysis & Mitigation Strategies
Supply Chain Risks: Dependence on global fabs (TSMC, Samsung, Intel).
Technical Risks: Chiplet interoperability, reliability under extreme conditions.
Market Risks: Competition from existing semiconductor giants.
Mitigation Plan: Multi-vendor collaborations, in-house R&D, and regulatory support.
10. Conclusion & Recommendations
Provide justification for government funding and industry partnerships.
Outline next steps, including global engagements (IMEC ACP Forum, ASRA Consortium).
Expected Deliverables & Timelines:
Draft DPR Report (within 6 weeks): High-level structure and initial findings.
Stakeholder Consultation (Weeks 7-12): Engagement with industry experts, policymakers, and technology partners.
Final DPR Submission (Week 16): Comprehensive, government-ready DPR covering technical, financial, and policy aspects.
Presentation & Review Meeting: Consultant to present DPR findings to key stakeholders.
Skills Required
- Ph.D. or Master’s degree in Semiconductor Engineering, Electrical Engineering, Computer Science, or a related field.
- 10+ years of experience in semiconductor technology, chiplet architecture, or automotive electronics.
- Expertise in chiplet packaging, heterogeneous integration, and die-to-die interconnect standards.
- Familiarity with functional safety standards (ISO 26262, ASIL) and automotive-grade reliability.
- Experience in government-funded semiconductor projects or large-scale R&D programs is a plus.
- Strong analytical and problem-solving skills with the ability to develop feasibility studies and risk mitigation plans.
- Prior experience working with industry stakeholders such as TSMC, Samsung, Intel, IBM, IMEC, Bosch, or ARM is highly desirable.
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6 month(s)
5+ years 
On-Site
